Infineon figured at the top of my recent list of 3G iPhone’s Top 5 Component Beneficiaries. It is a major beneficiary with four wins: the digital baseband processor, a UMTS transceiver, a power management chip and a GPS chip. But there is a bigger beneficiary without a single design win in the 3G iPhone: Qualcomm.
Cadence announced rather unimpressive Q2 results yesterday. Revenues of $329 million were higher than the market’s expectations and grew 15% sequentially but recorded a 16% year-on-year decrease.
VMware (VMW) is facing troubled times. With the recent announcement of Microsoft entering the hypervisor (virtual machine monitor) business, the management change of CEO Diane Greene getting fired and management having to revise down guidance, the stock has hit quite a turbulent patch.
I recently listed the top 5 component beneficiaries of the 3G iPhone (minus Qualcomm, which is coming). In this post, I cover how Texas Instruments (TI), STMicro (STM), and Broadcom (BRCM) benefit from the 3G iPhone. I also discuss their recent earnings reports.
Yesterday, SanDisk Corporation (NASDAQ:SNDK), a leading flash storage cards supplier, reported disappointing second quarter results that yet again missed analyst estimates. Results were driven by falling NAND flash prices and oversupply despite increasing demand. There are reports that Apple might change this situation with the huge demand for 3G iPhones and its ripple effect.
On July 17, Nokia Corporation (NOK) posted strong Q2 results that topped analyst estimates, driven by 21% growth in mobile device sales to 122 million units, an average of 1.35 million units per day. In the converged mobile device section, sales grew 10% to 15.3 million units, much more than the iPhone’s target for the
SunPower (SPWR) continued to outperform market expectations in their recently announced Q2 earnings release.
The 3G iPhone is out. Besides Apple, who else is a beneficiary of this major PR event? Here, we look at the top five component vendors: Infineon, Triquint, Samsung, Broadcom and Interdigital.