The Ultimate 1Mby1M Decision Guide: Curriculum, Learning Style & Structure

1. Is the 1Mby1M program suitable if I’m still validating my idea or have several ideas to sort through?

Chip VCs: Enhanced “nerd” factor needed

I mentioned Chip Scale Packing (CSP), which I should also explain further. In simple terms, for these miniaturized consumer devices, Printed Circuit Board (PCB) real estate is a big problem. CSP is a packaging technology that allows chips to be packaged “at the scale of the chip” with marginally more area requirement. In recent times,

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SiP is a major discontinuity

Okay, so I should explain what is the big deal about System-in-Package (SiP) … You must have noticed the trend in cellular handsets of packing in dramatically diverse functionality? Samsung’s latest model has a 5 Mega Pixel camera, and if this is any indication, consumers will further reap benefits of such integration trends in the

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SiP versus Structured ASICs

Semiconductors and Electronics have invaded every aspect of our lives in fairly extensive ways. During the last quarter of the twentieth century, this segment received enormous attention, venture investment, and duly provided some amazing vision, thought leadership, and innovation. Now, in the first decade of the 21st Century, the industry is showing signs of hitting

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